unichip p1

unichip p1

unichip p1

Product catalog summary
Product Overview: UniCHIP P1 is a wood-based panel designed for general use in dry spaces, adhering to service class 1 as per EN 1995-1-1 standards. It features a high-density middle layer, fine sanding quality, and low formaldehyde content (E1), making it suitable for construction and interior applications.
Specifications: UniCHIP P1 is a three-layer board with a high-density middle layer and finely sanded surface layers. It is manufactured using UF glue compressed with chips at high temperatures for optimal adhesion. The board is made from sustainably sourced wood.
Manufacturing Options: The product is available in various thicknesses, widths, and lengths, produced using continuous and multi-daylight presses. Thickness ranges from 8mm to 60mm, width from 1830mm to 2650mm, and length from 2200mm to 6650mm.
Technical Properties: The board offers good screw-holding capabilities and is suitable for packaging materials. It can be finished in various ways, including sanding, painting, HPL or CPL, veneer applications, lacquering, and tongue and groove.
Certifications: UniCHIP P1 is available with PEFC and FSC labels upon request, and its manufacturing complies with ISO 9001 standards. It also meets CARB P2 requirements.
Key Technical Data:
  • Density: 610-720 kg/m3
  • Bending Strength: 7.0-10.5 N/mm2
  • Tensile Strength: 0.14-0.28 N/mm2
  • Moisture Content: 5-13%
  • Formaldehyde Class: E1 (<8mg/100g DS)
Contact Information: For more details on sawing capacity, thicknesses, finishes, or CARB P2 compliance, contact the sales department at [email protected].
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Catalog excerpts

unichip p1-1

uni BOARDS P1 UniCHIP P1 is a wood based panel suitable for gnral use in dry spaces, in accordance with service class 1 according to standard EN 1995-1-1. ✓ High density middle layer ✓ Fine sanding quality ✓ Low formaldehyde content (E1) ✓ Strong technical properties www.unilinpanels.com

 Open the catalog to page 1
unichip p1-2

uni P1 BOARDS Description UniCHIP P1 is a three-layer board with a high density middle layer and a level sanded surface layer of fine particles on the top and bottom surfaces of the board. During the manufacturing process, the UF glue is compressed with the chips at a high temperature and the glue is distributed evenly to ensure optimum adhesion. This board is mainly used for general construction and interior applications. UniCHIP P1 is made of wood from sustainable, managed forests of non-controversial origin. Range and options UNILIN, division panels runs 2 continuous presses and 1 Multi-Daylight...

 Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.