Power Modules
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POWER MODULES power Modules

Innovative Power Devices for a Sustainable Future Mitsubishi Electric power modules are at the forefront of the latest energy innovations that seek to solve global environmental issues while creating a more affluent and comfortable society for all. Some of these innovations are photovoltaic (PV) and wind power generation from renewable energy sources, smart grids realizing efficient supply of power, hybrid/electric vehicles (HVs/EVs) that take the next step in reducing carbon emissions and fuel consumption, and home appliances that achieve ground-breaking energy savings. Whether in...

Focus Technology 7th-Generation 1,200V-Class IGBT Chip Technology Cutting-edge technology realizes energy-saving inverter devices • Latest thin-wafer processing (n-drift layer) achieves thinner wafer than 6th-generation devices • Performance improved by combining CSTBT TM * and light punch-through (LPT) structures • Inverter system power dissipation minimized by its superior performance(lower VCEsat and Eoff) *CSTBT: Mitsubishi Electric’s unique IGBT that makes use of carrier cumulative effect n-drift layer The latest thin wafer process Comparison of power loss Optimize wafer thickness...

Surface mount package IPM New Products Surface mount package IPM MISOPTM A small Surface mount package IPM has been newly developed for fan and low-power motor drive applications Optimal pin layout realizes easier PCB wiring design and enables smaller PCB size ・ Insulation distance between pins ensured, realizing easier board mounting without coating process ・ Newly integrated interlock function in addition to conventional protection features for robust operation
 ・ Installing RC-IGBT*1 simultaneously realizes compact package and low loss performance can go thogether ・ Bootstrap diode is...

Feature Products Smaller package size realized by integrating newly designed RC-IGBT Recommended for low-cost inverter and fan controller applications SLIMDIPTM SLIMDIP-S, SLIMDIP-L RC-IGBT *1 incorporated, reducing package size 30% compared to Super-mini DIPIPM ・ Maximum case temperature increased from 100°C to 115°C, increusing the operating ・ temperature range and leading to easier system design Additional terminals for floating supply and built-in bootstrap diodes simplify PCB wiring ・ pattern Both VOT *2 and OT *3 functions integrated for temperature protection ・ *1 RC-IGBT: Reverse...

■ Series Matrix of 600V / 500V DIPIPMTM Vces(V) [Notes] *1 : PSSxxS92E6 has OT function, PSSxxS92F6 has Vot function *2 : AC60Hz,1minute.Corresponds to isolation voltage 2500Vrms in the case the convex-shaped heat sink *3 : High melting point solder (Lead Over 85%) is used for chip soldering of PSSxxS51F6 only. *4 : Molding resin insulation for PSSxxS51F6/-C *5 : PSS50NC1F6 is not included brake. ■ Application circuit of super mini DIPIPM™ [Term] CSTBTTM: Mitsubishi Electric's unique IGBT that makes use of the carrier cumulative effect RC-IGBT: Reverse conducting IGBT HVIC: High Voltage...

■ Series Matrix of 1200V DIPIPM™ ★: New Product Non-recommended : Please contact to the sales offices. [Notes] *1: PSS**NC1FT is not included brake ■ Type Name Definition of DIPIPMTM -» Voltage class Function Series Package Circuit construction Rated current Chip type * DIPIPM BSD: Bootstrap Diode CSTBTTM: Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect. HVIC: High Voltage IC, LVIC: Low Voltage IC UV: Supply Under Voltage protection, OT: Over Temperature protection, SC: Short Circuit protection VOT: Analog temperature output RoHS: Restriction of hazardous...

Line-up of DIPIPMTM ■ Outline Drawing of DIPIPMTM Mini DIPIPM (PSSxxS71F6) 1200V Mini DIPIPM Super mini DIPIPM Ver.6 MOSFET Super mini DIPIPM Long (A) HEAT SINK SIDE HEAT SINK SIDE HEAT SINK SIDE SLIMDIP Short SLIMDIP Long

© New Products Loaded with built-in functions, contributing to inverters with enhanced energy savingsG1 Series IPM with 7th-generation IGBT <Main Features> •Power loss has been reduced with the introduction of the 7th-generation IGBT produced using CSTBT™'1 and a diode incorporating a RFC'2 structure that contributes to reducing the power consumed in inverters •The new resin-insulated metal baseplate, originally introduced in 7th-generation IGBT modules, eliminates the solder-attached section, increasing the thermal cycle lifetime and improving inverter reliability •In addition to the...

Line-up of IPM ■ Matrix of IPM Modules 650V/600V VCES(V) Series IC(A) (No.: Number of outline drawing, see page 11 to 12) PM800DV1B060 CSTBT＊1 Emi ter sensor installed ｔ Temperature sensor installed IGBT chip CSTBT＊1 CSTBT＊1 Built-in emitter sensor Built-in emitter sensor Built-in temperature sensor Built-in temperature sensor CSTBT＊1 Built-in emitter sensor Built-in temperature sensor CSTBT＊1 CSTBT＊2 Built-in emitter sensor Built-in emitter sensor Built-in temperature sensor Built-in temperature sensor S-DASH SERVO RoHS directive Compatibility UV: Supply Under Voltage-lock protection, SC:...

■ Matrix of IPM Modules 1200V (No.: Number of outline drawing, see page 11 to 12) ★: New Product | Non-recommended |: Please contact to the sales offices. [Notes] *1: Full-gate CSTBTTM *2: PCM (Plugged Cell Merged) CSTBTTM [Term] UV : Supply Under Voltage-lock protection, SC : Short-Circuit Protection, OT : Over-temperature protection, OC : Over-current protection, RoHS : the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment

Line-up of IPM ■ Outline Drawing of IPM 3-M6 NUTS SCREWING DEPTH 9.5

6-M4 NUTS SCREWING DEPTH 6.5

Line-up of MOSFET Modules Series Matrix of MOSFET Modules VDSS RoHS directive compliant Outline Drawing of MOSFET Modules Unit :mm

IGBT Modules New Products New lineup contributes to simplifying design, downsizing, energy-saving s of industrial inverters. IGBT Module T/T1-Series New modules equipped with three-phase converter, inverter, and brake circuit(CIB), contributes to simplifying design for inverter systems ・ CIB modules contribute to compact inverter systems by reducing package size by 36% compared to the Mitsubishi Electric's existing module.(CIB) ・ • Power loss has been reduced with the introduction of the 7th-generation IGBT produced using CSTBTTM*2 and a diode incorporating a relaxed field of cathode (RFC)...