Power Modules Catalog
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POWER MODULES

Innovative Power Devices for a Sustainable Future Mitsubishi Electric power modules are at the forefront of the latest energy innovations that seek to solve global environmental issues while creating a more affluent and comfortable society for all. Some of these innovations are photovoltaic (PV) and wind power generation from renewable energy sources, smart grids realizing efficient supply of power, hybrid/electric vehicles (HVs/EVs) that take the next step in reducing carbon emissions and fuel consumption, and home appliances that achieve ground-breaking energy savings. Whether in...

Wind power generation Household electrical appliances Inverters Energy Creation Induction Heating cooking stoves Smart grid Photovoltaic power generation Effective use of energy Motors Electric/ hybrid vehicles Industrial robots Modules with built-in control and protection circuits for AC servo robots and PV power generation IPM Intelligent Power Modules Key Features Built-in protection circuit for short-circuiting, power supply undervoltage and overheating Highly compatible package with simplified printed circuit board (PCB) design Special intelligent power modules (IPMs) for power...

Line-up of DIPIPMTM Series Matrix of DIPIPM 600V Super mini type Mini Type Ver.6 Super mini type Mini Type Large Type Super mini type Mini Type Large Type Protective Function Full-gate CSTBT IGBT/MOSFET Full-gate CSTBT Full-gate CSTBT P-side/N-side P-side/N-side P-side/N-side P-side/N-side P-side/N-side P-side/N-side P-side/N-side P-side/N-side N-side w/sense Active Input Emitter pin of N-side Specification Fault Output Insulation voltage N-side (UV, SC, OT) N-side (UV, SC, OT) N-side (UV, SC) N-side (UV, SC) N-side (UV, SC) 1500Vrms*3 N-side (UV, SC) N-side (UV, SC, OT) N-side (UV, SC)...

Outline Drawing of DIPIPMTM Industrial DIPIPM (PSSxxS71F6) Mini DIPIPM Ver.4 MOSFET Mini DIPIPM DIPPFC Super Mini DIPIPM Ver.6 MOSFET Super Mini DIPIPM Super Mini DIPIPM Ver.5 Long (A) 38±0.5 HEAT SINK SIDE HEAT SINK SIDE HEAT SINK SIDE

Line-up of IPM Series Matrix of 600V IPM (No.: Number of Outline Drawing, see page 7) VCES (V) Series IC (A) S-DASH Series Connection No. CSTBT*1 CSTBT*1 CSTBT*1 Built-in Emitter Sensor Built-in Emitter Sensor Built-in Emitter Sensor Built-in Temperature Sensor Built-in Temperature Sensor Built-in Temperature Sensor IGBT Chip PM450CLA060 C 08 PM600CLA060 C 08 CSTBT*2 CSTBT*1 Planar Built-in Emitter Sensor Built-in Emitter Sensor Built-in Emitter Sensor Built-in Temperature Sensor Built-in Temperature Sensor RoHS Directive S-DASH SERVO UV: Supply Under Voltage-lock protection, SC:...

Series Matrix of 1200V IPM (No.: Number of Outline Drawing, see page 7) VCES (V) Series IC (A) S-DASH Series 300 450 CSTBT*1 Built-in Current Sensor Built-in Temperature Sensor CSTBT*1 Built-in Current Sensor Built-in Temperature Sensor CSTBT*1 Built-in Current Sensor Built-in Temperature Sensor CSTBT*2 Built-in Current Sensor Built-in Temperature Sensor RoHS Directive S-DASH SERVO IGBT Chip Planar Built-in Current Sensor UV: Supply Under Voltage-lock protection, SC: Short-Circuit Protection, OT: Over-temperature protection, OC: Over-current protection, CSTBT TM: Carrier Stored Trench-Gate...

Line-up of IPM Outline Drawing of IPM 3-M6 NUTS SCREWING DEPTH 9.5

Power Modules for Vehicles Features IPMs Transfer-molded Power Modules ( T-PMs) Drive circuit and protection circuits for short-circuiting, power supply undervoltage and overheating Redundancy function for failsafe design and high system performance, chip temperature analog output function and DC-link voltage analog output function (optional specifications) Equipped with built-in photocoupler facilitating insulated design, and a built-in easy-to-assemble connector for automobiles High noise tolerance as the result of a built-in mass lamination board and circuit pattern optimization...

Line-up of MOSFET Modules Series Matrix of MOSFET Modules RoHS Directive Compliant Outline Drawing of MOSFET Modules Unit:mm

Line-up of IGBT Modules Evolution of IGBT Module Series Type Name Definition of IGBT Modules Series name Voltage class Outline drawing and other specifications Connection type New-MPD Type Rated current capacity IGBT Module Features of IGBT Module Series S Series Lineup includes various package types. 6th-generation CSTBT delivers low-loss performance. Thinner package. (Height: 17mm) NX type) Suited to large-capacity applications (2500A/1200V, 1800A/1700V) (New-MPD type) High-speed CSTBT TM delivers low-loss performance. Soft switching (resonant) turn-off function (ZVS) Enhanced inner...

Line-up of IGBT Modules Series Matrix of 6th-generation of IGBT ModulesS Series>1200V/1700V (No.: Number of Outline Drawing, see page 12 to 14) RoHS Directive Compliant A/NF Type New-MPD Type MPD Type Connection No. Connection No. Connection No. MPD Type New-MPD Type Connection No. Connection No. : Under Development Series Matrix of 5th-generation of IGBT Modules1200V/1700V (No.: Number of Outline Drawing, see page 12 to 14) RoHS Directive Compliant NF Series A Series MPD Series NFH Series F Series Connection No. Connection No. Connection No. Connection No. Connection No. MPD Series A...

Outline Drawing of IGBT Modules (SCREWING DEPTH) * All dimensions with a tolerance of * All dimensions with a tolerance of * All dimensions with a tolerance of * All dimensions with a tolerance of (SCREWING DEPTH) * All dimensions with a tolerance of

Line-up of IGBT Modules Unit: mm 3 - M5 Nuts 4–ø6.5 MOUNTING HOLES (SCREWING DEPTH)

Outline Drawing of IGBT Modules SCREWING DEPTH 116 .5 12x position tolerances base plate holes SCREWING DEPTH 4-ø6.5 MOUTING HOLES 3-M6 NUTS

Line-up of HV Modules Series Matrix of HVIGBT/HVIPM (No.: Number of Outline Drawing, see page 16 and 17) Vces 1700V Type Description (H Series: standard) HA: Cu Base plate, HB: Cu Base plate, HC: AlSiC Base plate, HG*: AlSiC Base plate (N Series: CSTBT TM) N: AlSiC Base plate (CM1200DB-34N: Cu Base plate), NB: AlSiC Base plate (Outline of H Series) (R Series: Low Loss) R: AlSiC Base plate, RG*: AlSiC Base plate (S Series: CSTBT TM (III)) S: AlSiC Base plate *: High-Insulation Package (10.2kV, AC 1min.) Non-Recommended : Please refrain from adopting newly. Series Matrix of HVDIODE Modules...