Overview

Mitsubishi Electric's power modules are advanced semiconductor devices designed to support energy innovations addressing global environmental challenges. These modules are widely used in renewable energy systems (photovoltaic, wind), smart grids, hybrid/electric vehicles, and energy-efficient appliances. They improve energy efficiency and contribute to reducing carbon emissions and fuel consumption.

Key Characteristics

• Utilization of 7th generation IGBT technology, reducing low-current losses by approximately 15%, enhancing efficiency especially in low-load applications like air conditioners and household appliances.
• Built-in diodes reduce the need for external components, lowering overall circuit costs.
• Full pin compatibility with previous series (e.g., Super mini DIPIPM Ver.5) enables easy upgrades and replacements.

Product Focus and Features

Super mini DIPIPM Ver.6 Series

• Incorporates 7th generation IGBT and CSTBT structure optimized for inverter-driven household appliances to reduce power consumption.
• Transfer-molded structure with high heat conductivity insulation sheets ensures effective heat dissipation and electrical insulation.
• High-voltage ICs integrate drive, protection, and level-shift circuits allowing direct CPU/microcontroller control.
• Compact design with single power supply and photocoupler-less systems enhances reliability and reduces size.
• Includes built-in bootstrap diode (BSD) for simplified circuit design.

Applications

• Smart grids, photovoltaic and wind power generation systems.
• Household electrical appliances and low-capacity inverters.
• Electric/hybrid vehicles, industrial robots, railways, and induction heating cooking stoves.

Additional Module Types

• Intelligent Power Modules (IPMs) with integrated control and protection circuits for AC servo robots and photovoltaic systems.
• IGBT Modules for general-purpose inverters with low-inductance packages and large-capacity options for renewable energy.
• Vehicle power modules including EV/PHEV modules with built-in temperature analog outputs and compliance with environmental regulations (End-of-Life Vehicles Directive).
• High Voltage IGBT (HVIGBT) and diode modules for railway inverters, supporting high voltage, current, and insulation requirements.

Series and Product Lineup

• Voltage classes range from 25V to 1200V, with rated currents and package types tailored to applications.
• Protection functions include under-voltage (UV), short-circuit (SC), over-temperature (OT), and over-current (OC) protections.
• Compliance with RoHS directives ensures restriction of hazardous substances.
• New and under-development products are clearly indicated; non-recommended or obsolete models are advised against.

Technical Details and Diagrams

• Graphs demonstrate IGBT saturation voltage improvements from 6th to 7th generation, showing reduced DC loss at low currents.
• Application circuit diagrams for built-in BSD DIPIPM modules detail microcontroller connections, shunt resistors, and fault outputs.
• Outline drawings provide precise mechanical dimensions for DIPIPM and IPM packages to support design and integration.
• Equivalent circuit diagrams illustrate internal connections and protection features of specific modules.

Standards and Compliance

• Modules comply with environmental and safety standards including RoHS and End-of-Life Vehicles Directive.
• High insulation voltage ratings (up to 2500Vrms) are achieved using insulation sheets or molding resin for safety and reliability.
• Lead-free soldering is standard for pin plating and chip soldering, except for select models using high melting point solder.

Best Practices and Recommendations

• Use 7th generation IGBT modules to improve efficiency in low-load and long-duration applications.
• Leverage built-in protection and control circuits to simplify PCB design and enhance system reliability.
• Select modules compliant with environmental directives and appropriate for voltage/current requirements.
• Consult series matrices and outline drawings for correct module selection and mechanical integration.
• Avoid non-recommended or obsolete modules to maintain performance and supportability.

Mechanical Specifications and Mounting Details

• Multiple mounting hole patterns specified with diameters (e.g., ø5.5 mm, ø6.5 mm, ø2.5 mm) and screw depths (~7.5 mm), ensuring secure installation.
• Mounting configurations include 6-M5 nuts, 12-M6 nuts, 3-M5 nuts, and 4-M6 nuts with precise spacing and tolerances (±0.25 mm to ±0.5 mm).
• Module outlines and mounting interfaces are dimensioned in millimeters with detailed tolerances for automotive assembly compatibility.
• Labels and tab numbers are provided for identification and assembly guidance.

Power Modules for Vehicles

• IPM and T-PM modules feature integrated drive and protection circuits for short-circuit, undervoltage, and overheating protection.
• Optional redundancy functions support failsafe designs and enhanced system performance.
• Analog outputs for chip temperature and DC-link voltage monitoring improve system diagnostics.
• Built-in photocouplers provide insulation and facilitate automotive connector assembly.
• High noise tolerance achieved via mass lamination boards and optimized circuit patterns.
• Transfer molding and direct lead bonding (DLB) reduce internal wiring resistance and inductance.
• Completely Pb-free construction complies with environmental regulations.
• High power and temperature cycle life ensured by precise chip temperature sensors and production traceability.

Product Line-up for Vehicle Modules

• Models include PM150CJG120G, PM300CJG060G, PM600CJG060G, with voltage ratings of 650V and 1200V.
• Current ratings range from 8A to 150A depending on model.

MOSFET Modules

• Series include FM200TU, FM400TU, FM600TU with voltage ratings of 75V, 100V, and 150V.
• Mechanical outlines specify mounting hole sizes (e.g., ø6.5 mm) and module dimensions.
• Modules comply with RoHS Directive for environmental safety.

IGBT Modules

• Various package types featuring 6th-generation CSTBT technology for low-loss performance.
• Thinner packages (~17 mm height) enable space-saving designs.
• High-capacity modules support up to 2500A/1200V and 1800A/1700V.
• Soft switching (resonant) turn-off (ZVS) and enhanced inner wiring reduce skin effect losses.
• Compliance with RoHS and environmental regulations.

IGBT Series and Models

• Includes S Series (6th gen), NFH Series, MPD Series, NX Series, A Series, and F Series.
• Voltage classes: 600V, 1200V, 1700V; rated currents from 35A to 2500A.
• Models such as CM75MX-12A, CM150RX-12A, CM600HU-12F, CM300DY-24NF, CM900DUC-24NF are listed with connection types and outline references.
• New and under-development products are identified; UL authentication status is noted.

General Notes and Compliance

• All dimensions are in millimeters with tolerances typically ±0.25 mm to ±0.5 mm.
• Modules comply with environmental directives including RoHS and End-of-Life Vehicle regulations.
• Mechanical and electrical specifications meet automotive industry standards for reliability and safety.

Summary of Critical Information

• Mounting: Precise hole sizes and screw depths ensure secure installation; nut sizes vary (M4, M5, M6, M8) depending on module.
• Electrical Ratings: Voltage classes from 75V to 1700V; current ratings from 8A to 2500A across module types.
• Protection Features: Integrated circuits for short-circuit, undervoltage, and thermal protection enhance reliability.
• Environmental Compliance: Pb-free construction and adherence to RoHS and End-of-Life Vehicle directives.
• Innovations: Use of DLB technique, transfer molding, and advanced IGBT technologies improve performance and durability.

High Voltage (HV) Power Modules

• Includes IGBT modules, HVIPM, and high voltage diode modules with detailed mechanical dimensions and mounting hole specifications.
• Mounting holes vary in diameter (6.5 mm, 7 mm) with tight tolerances (±0.1 mm to ±0.5 mm).
• Screw types include M3, M4, M6, M8 with minimum screwing depths from 4 mm to 16.5 mm.
• Base plates use Copper (Cu) or Aluminum Silicon Carbide (AlSiC) depending on series.

Series Matrix and Product Line-up for HV Modules

• Current ratings from 200A to 2400A; voltage classes from 1700V up to 6500V.
• Connection types and base plate materials categorized into standard (H series), CSTBT (N and S series), and low loss (R and F series).
• Module types include IGBT (CM series), diode (RM series), and HVIPM (PM series).
• New products and modules under development are marked; some are non-recommended for new adoption.

Technical Parameters and Designations

• Module names encode current rating, voltage class, and base plate type.
• Connection types use letter codes indicating base plate and package characteristics.
• High-insulation packages withstand up to 10.2 kV AC for 1 minute, ensuring safety.

Mounting and Assembly Recommendations

• Strict adherence to mounting hole tolerances and screw depths is essential for mechanical stability and electrical performance.
• Specified nut sizes and quantities per module must be used (e.g., 6-M8 nuts, 3-M4 nuts).
• Standardized label placement and orientation support identification and assembly consistency.

Additional Information

• Further details and updates are available on Mitsubishi Electric's website.
• Specifications are subject to change without notice; publication effective from November 2013.
• All rights reserved by Mitsubishi Electric Corporation.

Conclusion

This comprehensive technical document serves as a key reference for engineers and designers integrating Mitsubishi Electric's power modules into automotive, renewable energy, and industrial systems. It provides critical mechanical and electrical specifications, product line-ups, protection features, environmental compliance details, and best practice recommendations to ensure optimal module selection, integration, and system reliability.