Resyflex® CP3
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Catalog excerpts

Resyflex® CP3 - 1

MASTICS AND ADHESIVES / Adhesives for hardwood floors Resyflex® CP3 Elastic polyurethane adhesive for hardwood floors Single-component, high-performance, polyurethane-based adhesive, for solid hardwood or laminate floors. GREENBUILDING RATING® PRODUCT STRENGTHS Resyflex® CP3 -- Category: Sealants and adhesives -- Adhesives for hardwood floors • Quick curing • Strong adhesion for all types of hardwood floor • Elastic • Compensates for subfloor irregularities • Compensates for wood movement • Reduces vibrations • Reduces noises of foot traffic No environmental hazard rating RATING SYSTEM ACCREDITED BY CERTIFICATION BODY SGS AREAS OF USE Use For solid hardwood or laminated floors up to 140 mm width. In strips, tongue-and-groove strips, panels and hardwood mosaic floors. Adhesive suitable for the laying of hardwood floors on underfloor heating systems (compulsory full surface bonding). The surface evenness defects must not exceed - 1 mm maximum rise when measuring with a 20 cm-long ruler - 5 mm maximum rise when measuring with a 2 m-long metre The dryness of the surface must be checked with the CM method (calcium carbide). Pin-type or pinless moisture meters can be used as indications. The maximum moisture content of the laying surface must be: - 3% R.H. for an hydraulic binder-based surface - 0.5% for calcium sulphate-based screed When specifically laying on underfloor heating systems When laying on underfloor heating systems, the natural drying of the laying surface must be completed by putting the heating to temperature and keeping it at least three weeks before laying the hardwood floor. Heating must be switched off 48 hours before applying the smoothing plaster and laying the hardwood floor. Provide additional heating. The heating system must not be reactivated before a week after laying the hardwood floor, and in any case in a progressive manner. The maximum moisture content for laying on underfloor heating systems must be: - 2% R.H for an hydraulic binder-based surface - 0.5% for calcium sulphate-based screed For the preparation of the substrates use EP21, according to the instructions detailed in the related product technical data sheet. Substrate preparation The substrate and its preparation must comply with the requirements of the DTU 51.2 (NFP 63-202). The substrate must be dry, cohesive, clean, smooth, free from flaky or non-adherent particles, cement dust, rust, bitumen, silicone, old adhesives, grease, treating and finishing products, wax, cleaning products or liquids... It must not protrude and must be cleaned with a vacuum cleaner to eliminate all dust residues. The flooring must not allow the hardwood floor to rise or be subjected to any form of moisture infiltration. For concrete floors on crawl spaces, embankments or load-bearing plates, it is recommended to insert a barrier to block moisture (anti-capillary covering or layer depe

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Resyflex® CP3 - 2

INSTRUCTIONS FOR USE Application In accordance with the DTU 51.2, the temperature of the premises, of the substrate (slab) and of the adhesive must be at least +15 °C at the time of application and during the entire process of polymerization of the adhesive. When laying on underfloor heating systems, the temperature of the substrate must be about +20 °C at the time of application and during the entire process of polymerization of the adhesive. The application can be performed only if the air in the rooms has a moisture of between 45% and 65% of hygrometry. The moisture level of the rooms at...

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