Prospekt System K1060PB

Product catalog summary

Construction and Design: The System K 1060 PB is designed with zinc-coated tubular steel supports housed in floor joints. These supports are connected to C-profiles using a cross-connector, ensuring an electrically conductive joint as per VDE standards. The system allows for seamless leveling through an adjustable thread, accommodating a tolerance of ±30 mm. The modular design can be fully or partially disassembled for inspection or retrofitting.

Technical Data: The construction grid is available in sizes 1200 x 600 mm and 600 x 600 mm, with special sizes upon request. The system supports area loads of 15 kN/m² to 30 kN/m² and individual loads of 3 kN to 5 kN. The panel thickness is approximately 40 mm, and the overall height ranges from 180 mm to 2500 mm. The structure is adjustable and offers fire protection options of F30, B2, B1, and A2.

Floor Panels: The floor panels are made from high-density multi-layer chipboard or mineral fiber, milled for a gap-free fit. Edges are protected with synthetic strips, and the panels are coated with aluminum or galvanized steel based on application needs. Various floor coverings, including PVC, linoleum, rubber, and textiles, are compatible, with a wide selection of colors and patterns available.

Applications: The system is suitable for creating cavities for wiring in various environments such as measuring and control areas, high and low-voltage systems, control rooms, and transformer rooms. Examples include switchgear cabinet substructures, double-floor systems with integrated cable trays, and vertical cable feeds.

Catalog excerpts

Konstruktion Die Konstruktion zur Auflage der Bodenplatten besteht aus verzinkten Stahlrohrstützen, die in Fußgelenken gelagert werden. Die C-Profile werden am Stützenkopf mit dem Kreuzverbinder verschraubt. Diese Verschraubung ist nach VDE elektrisch leitend ausgeführt. Die Rastergröße richtet sich nach der geforderten Tragfähigkeit. Die Nivellierung erfolgt stufenlos durch ein Einstellgewinde. Zur Revision oder zum Nachrüsten lassen sich die Bodenplatten und das Rastersystem ganz oder teilweise demontieren. Design The structure for supporting the floor panels consists of zinccoated tubular steel supports which are located in floor plates and are fitted on the head or support plate (cross-connector) with a threaded levelling device permitting a tolerance of ± 30 mm. According to load requirements, the supports are bolted to the C-profiles to form a suitably dimensioned modular system on which floor panels of suitable size are placed. The joint is electrically conductive in accordance with VDE. For inspection or retrofitment, the floor panels and, if necessary, the modular system can be wholly or partly disassembled and reassembled.

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Anwendungsbeispiele Schaltschrank-Unterkonstruktionen mit Grundrahmen (Bild 1), Doppelboden-Anlagen mit integriertem Kabeltragsystem (Bild 2), Kabeltragsystem und vertikale Kabelzuführung (Bild 3) Application Switchgear cabinet subsstructure with base frame. (pic. 1), Double-floor systems with integrated cable tray system (pic. 2), Cable tray system and vertical cable feed (pic. 3). Hochverdichtete Mehrschichtenspanplatten oder Mineralstoffplatten. Kunststoff-Umleimer, 0,6 mm dick, leitend/isolierend Aluminiumfeinblech oder Stahlblech, Mineralstoff auch ohne Rückseitenbeschichtung 10 Stahl-Fußgelenk...

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