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RESITRIX® PU-LMF-02

Product catalog summary

Applications
PU-LMF-02 adhesive is designed for bonding the RESITRIX® CL waterproofing membrane to various substrates including bituminous materials, EPS foam boards (type DAA-dm or DAA-dh), timber materials, and solid materials. For substrates not listed or specific requirements, contact the Technical Department.

Product Description
PU-LMF-02 is a single-component, solvent-free polyurethane adhesive, developed for bonding surfaces of the RESITRIX® CL EPDM waterproofing membrane.

Processing
The adhesive should be applied in strips in bead form, avoiding seams and adhesive accumulation. The processing temperature ranges from +5 °C to +40 °C. Processing time is approximately 30 minutes, with a recommended time of 5 to 10 minutes.

Cleaning and Storage
Tools should be cleaned immediately after use with G 500 cleaner. The adhesive is moisture-sensitive and should be stored in an airtight, dry environment at +5 °C to +25 °C. Shelf life is 9 months in unopened containers.

Technical Data

Basis: Polyurethane
Colour: Blue
Consistency: Liquid, easy to brush
Density: approx. 1,065 kg/m³
Viscosity (at +23 °C): approx. 6,500 mPas
Thermal Stability: -40 °C to +80 °C
Consumption: Ø 200 g/m²
Product Code: 20019233

Safety and Handling
Follow EC safety data sheets and container label safety information when handling the product.

Contact Information
Carlisle Construction Materials Ltd., United Kingdom. Phone: +44 (0)1623 62 72 85, Email: [email protected]

Catalog excerpts

PU-LMF-02 PU adhesive is a free-flowing single-component polyurethane adhesive, free from solvents and softeners, specially developed for bonding surfaces of the RESITRIX® CL EPDM waterproofing membrane. APPLICATIONS PU-LMF-02 adhesive is used for strip substrate bonding of the RESITRIX® CL waterproofing membrane to: • ituminous materials B • PS foam boards, type DAA-dm or DAA-dh E • imber/timber materials T • olid materials S • f your substrate is not mentioned, you have I specific and detailed substrate requirements or individual processing requirements, please contact our Technical Department. RESITRIX® Product catalogue

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TECHNICAL DATA processing Processing temperature: +5 °C to +40 °C application i bonding PU-LMF-02 is applied evenly in strips in bead form to the bonding substrate. Keep the longitudinal and transverse seams free from adhesive. Avoid accumulations of adhesive. processing time Depending on the climate, temperature an humidity, processing time is approx 30 minutes in a normal climate. We recommend a processing time of 5 to 10 minutes - but the adhesive should be processed within a maximum of 30 minutes and before a skin appears to form. solvents and cleaning agents After use, the tool used should...

Open the catalog to page 2

RESITRIX® PU-LMF-02

RESITRIX® PU-LMF-02

Catalog excerpts

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